X66AK2G12ABY60
vs
66AK2G12ABYA60E
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
LFBGA, BGA625,25X25,32
|
LFBGA, BGA625,25X25,32
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
5A992.C
|
5A992.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2017-11-29
|
|
| JESD-30 Code |
S-PBGA-B625
|
S-PBGA-B625
|
| Length |
21 mm
|
21 mm
|
| Number of Terminals |
625
|
625
|
| Operating Temperature-Max |
70 °C
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA625,25X25,32
|
BGA625,25X25,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Seated Height-Max |
1.56 mm
|
1.56 mm
|
| Supply Voltage-Max |
0.945 V
|
0.945 V
|
| Supply Voltage-Min |
0.855 V
|
0.855 V
|
| Supply Voltage-Nom |
0.9 V
|
0.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
21 mm
|
21 mm
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare X66AK2G12ABY60 with alternatives
Compare 66AK2G12ABYA60E with alternatives