XA6SLX25-2FG484Q vs XC6SLX25-3FG484C feature comparison

XA6SLX25-2FG484Q AMD Xilinx

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XC6SLX25-3FG484C AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description BGA, BGA484,22X22,40 23 X 23 MM, 1 MM PITCH, FBGA-484
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.26 ns 0.21 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1879 1879
Number of Inputs 266 266
Number of Logic Cells 24051 24051
Number of Outputs 266 266
Number of Terminals 484 484
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1879 CLBS 1879 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.2 V 1.14 V
Supply Voltage-Nom 1.23 V 1.2 V
Surface Mount YES YES
Temperature Grade AUTOMOTIVE OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 23 mm
Base Number Matches 1 1
Pbfree Code No
Part Package Code BGA
Pin Count 484
ECCN Code 3A991.D
Clock Frequency-Max 862 MHz
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Technology CMOS
Time@Peak Reflow Temperature-Max (s) 30

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Compare XC6SLX25-3FG484C with alternatives