XC17S150APD8C vs BR24T128-WZ feature comparison

XC17S150APD8C AMD Xilinx

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BR24T128-WZ ROHM Semiconductor

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer XILINX INC ROHM CO LTD
Part Package Code DIP
Package Description PLASTIC, DIP-8 DIP,
Pin Count 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.51
I/O Type COMMON
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0
Length 9.3599 mm 9.27 mm
Memory Density 1040096 bit 131072 bit
Memory IC Type CONFIGURATION MEMORY EEPROM
Memory Width 1 8
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1040096 words 16384 words
Number of Words Code 1040096 16000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1040096X1 16KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225 NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 4.5974 mm 5.33 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 1.6 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Samacsys Manufacturer ROHM Semiconductor
Clock Frequency-Max (fCLK) 0.4 MHz
Serial Bus Type I2C
Write Cycle Time-Max (tWC) 5 ms

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