XC2C128
vs
XC2C128-6VQG100C
feature comparison
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Transferred
|
| Ihs Manufacturer |
|
XILINX INC
|
| Part Package Code |
|
QFP
|
| Package Description |
|
14 X 14 MM, 0.50 MM PITCH, LEAD FREE, VQFP-100
|
| Pin Count |
|
100
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
12 Weeks
|
| Additional Feature |
|
YES
|
| Architecture |
|
PLA-TYPE
|
| Clock Frequency-Max |
|
152 MHz
|
| In-System Programmable |
|
YES
|
| JESD-30 Code |
|
S-PQFP-G100
|
| JESD-609 Code |
|
e3
|
| JTAG BST |
|
YES
|
| Length |
|
14 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
|
80
|
| Number of Inputs |
|
80
|
| Number of Macro Cells |
|
128
|
| Number of Outputs |
|
80
|
| Number of Terminals |
|
100
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
0 DEDICATED INPUTS, 80 I/O
|
| Output Function |
|
MACROCELL
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TFQFP
|
| Package Equivalence Code |
|
TQFP100,.63SQ
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Programmable Logic Type |
|
FLASH PLD
|
| Propagation Delay |
|
6 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Max |
|
1.9 V
|
| Supply Voltage-Min |
|
1.7 V
|
| Supply Voltage-Nom |
|
1.8 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
14 mm
|
| Base Number Matches |
|
1
|
|
|
|
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