XC2S100-5FG256I
vs
XCV100-6FG256I
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Pin Count |
256
|
256
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
52 Weeks
|
|
Clock Frequency-Max |
263 MHz
|
333 MHz
|
Combinatorial Delay of a CLB-Max |
0.7 ns
|
0.6 ns
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
e0
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
600
|
600
|
Number of Equivalent Gates |
100000
|
108904
|
Number of Inputs |
180
|
176
|
Number of Logic Cells |
2700
|
2700
|
Number of Outputs |
176
|
176
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
600 CLBS, 100000 GATES
|
600 CLBS, 108904 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2 mm
|
2 mm
|
Supply Voltage-Max |
2.625 V
|
2.625 V
|
Supply Voltage-Min |
2.375 V
|
2.375 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
1
|
1
|
Package Description |
|
FBGA-256
|
Technology |
|
CMOS
|
|
|
|
Compare XC2S100-5FG256I with alternatives
Compare XCV100-6FG256I with alternatives