XC2V1000-4FF896C vs XC2V1000-5FF896C feature comparison

XC2V1000-4FF896C AMD Xilinx

Buy Now Datasheet

XC2V1000-5FF896C AMD Xilinx

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FLIP CHIP, FBGA-896 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FLIP CHIP, FBGA-896
Pin Count 896 896
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 650 MHz 750 MHz
Combinatorial Delay of a CLB-Max 0.44 ns 0.39 ns
JESD-30 Code S-PBGA-B896 S-PBGA-B896
JESD-609 Code e0 e0
Length 31 mm 31 mm
Moisture Sensitivity Level 4 4
Number of CLBs 1280 1280
Number of Equivalent Gates 1000000 1000000
Number of Inputs 432 432
Number of Logic Cells 11520 11520
Number of Outputs 432 432
Number of Terminals 896 896
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1280 CLBS, 1000000 GATES 1280 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA896,30X30,40 BGA896,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm 31 mm
Base Number Matches 1 1

Compare XC2V1000-4FF896C with alternatives

Compare XC2V1000-5FF896C with alternatives