XC2V1500-6BGG575I vs XC2V1500-6BGG575C feature comparison

XC2V1500-6BGG575I AMD Xilinx

Buy Now Datasheet

XC2V1500-6BGG575C AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA575,24X24,50 31 X 31 MM, 1.27 MM PITCH, LEAD FREE, MS-034BAN-1, BGA-575
Pin Count 575 575
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 820 MHz 820 MHz
Combinatorial Delay of a CLB-Max 0.35 ns 0.35 ns
JESD-30 Code S-PBGA-B575 S-PBGA-B575
JESD-609 Code e1 e1
Length 31 mm 31 mm
Number of CLBs 1920 1920
Number of Equivalent Gates 1500000 1500000
Number of Inputs 392 392
Number of Logic Cells 17280 17280
Number of Outputs 392 392
Number of Terminals 575 575
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1920 CLBS, 1500000 GATES 1920 CLBS, 1500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA575,24X24,50 BGA575,24X24,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 31 mm 31 mm
Base Number Matches 1 1
ECCN Code 3A991.D
Temperature Grade OTHER

Compare XC2V1500-6BGG575I with alternatives

Compare XC2V1500-6BGG575C with alternatives