XC2V4000-6BFG957C vs XC2V4000-5BFG957C feature comparison

XC2V4000-6BFG957C AMD Xilinx

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XC2V4000-5BFG957C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957
Pin Count 957 957
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 820 MHz 750 MHz
Combinatorial Delay of a CLB-Max 0.35 ns 0.39 ns
JESD-30 Code S-PBGA-B957 S-PBGA-B957
JESD-609 Code e1 e1
Length 40 mm 40 mm
Moisture Sensitivity Level 4 4
Number of CLBs 5760 5760
Number of Equivalent Gates 4000000 4000000
Number of Inputs 684 684
Number of Logic Cells 51840 51840
Number of Outputs 684 684
Number of Terminals 957 957
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 5760 CLBS, 4000000 GATES 5760 CLBS, 4000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA957,31X31,50 BGA957,31X31,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 40 mm
Base Number Matches 1 1

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