XC2VP50-7FF1517C vs XC2VP50-7FFG1517I feature comparison

XC2VP50-7FF1517C AMD Xilinx

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XC2VP50-7FFG1517I AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FCBGA-1517 1 MM PITCH, FLIP CHIP, FBGA-1517
Pin Count 1517 1517
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1350 MHz 1350 MHz
Combinatorial Delay of a CLB-Max 0.28 ns 0.28 ns
JESD-30 Code S-PBGA-B1517 S-PBGA-B1517
JESD-609 Code e0 e1
Length 40 mm 40 mm
Moisture Sensitivity Level 4 4
Number of CLBs 5904 5904
Number of Inputs 852
Number of Logic Cells 53136
Number of Outputs 852
Number of Terminals 1517 1517
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 5904 CLBS 5904 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 40 mm
Base Number Matches 1 1

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Compare XC2VP50-7FFG1517I with alternatives