XC3020-50PQ100C vs OR2T06A-7M84I feature comparison

XC3020-50PQ100C AMD Xilinx

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OR2T06A-7M84I LSI Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC LUCENT TECHNOLOGIES INC
Part Package Code QFP
Package Description QFP, QFP100,.7X1.0 QCCJ, LDCC84,1.2SQ
Pin Count 100
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01
Additional Feature MAX 64 I/OS; 256 FLIP-FLOPS TYP. GATES = 6900 TO 15900
Clock Frequency-Max 50 MHz 10 MHz
Combinatorial Delay of a CLB-Max 14 ns 1.1 ns
JESD-30 Code R-PQFP-G100 S-PQCC-J84
JESD-609 Code e0 e0
Length 20 mm
Moisture Sensitivity Level 3
Number of CLBs 64 144
Number of Equivalent Gates 2000 6900
Number of Inputs 64 62
Number of Logic Cells 64 576
Number of Outputs 64 62
Number of Terminals 100 84
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 64 CLBS, 2000 GATES 144 CLBS, 6900 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QCCJ
Package Equivalence Code QFP100,.7X1.0 LDCC84,1.2SQ
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK CHIP CARRIER
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.1496 mm
Supply Voltage-Max 5.25 V 3.6 V
Supply Voltage-Min 4.75 V 3 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING J BEND
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm
Base Number Matches 3 4

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