XC3030-100PC84C vs XC3030-100PC84ISPC0107 feature comparison

XC3030-100PC84C AMD Xilinx

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XC3030-100PC84ISPC0107 AMD Xilinx

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code LCC LCC
Package Description PLASTIC, LCC-84 QCCJ,
Pin Count 84 84
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA 360 FLIP-FLOPS; TYP. GATES = 1500-2000
Clock Frequency-Max 100 MHz 100 MHz
Combinatorial Delay of a CLB-Max 7 ns 7 ns
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0
Length 29.3116 mm 29.3116 mm
Moisture Sensitivity Level 3
Number of CLBs 100 100
Number of Equivalent Gates 1500 1500
Number of Inputs 74
Number of Logic Cells 100
Number of Outputs 74
Number of Terminals 84 84
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 100 CLBS, 1500 GATES 100 CLBS, 1500 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 29.3116 mm 29.3116 mm
Base Number Matches 1 1

Compare XC3030-100PC84C with alternatives

Compare XC3030-100PC84ISPC0107 with alternatives