XC3064-125PQ160C vs OR2T06A-7M84I feature comparison

XC3064-125PQ160C AMD Xilinx

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OR2T06A-7M84I LSI Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC LUCENT TECHNOLOGIES INC
Part Package Code QFP
Package Description PLASTIC, QFP-160 QCCJ, LDCC84,1.2SQ
Pin Count 160
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01
Additional Feature 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA TYP. GATES = 6900 TO 15900
Clock Frequency-Max 125 MHz 10 MHz
Combinatorial Delay of a CLB-Max 5.5 ns 1.1 ns
JESD-30 Code S-PQFP-G160 S-PQCC-J84
JESD-609 Code e0 e0
Length 28 mm
Moisture Sensitivity Level 3
Number of CLBs 224 144
Number of Equivalent Gates 3500 6900
Number of Inputs 120 62
Number of Logic Cells 224 576
Number of Outputs 120 62
Number of Terminals 160 84
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 224 CLBS, 3500 GATES 144 CLBS, 6900 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QCCJ
Package Equivalence Code QFP160,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK CHIP CARRIER
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.92 mm
Supply Voltage-Max 5.25 V 3.6 V
Supply Voltage-Min 4.75 V 3 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING J BEND
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 28 mm
Base Number Matches 2 4

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