XC3090-70PQ160C vs XC3190A-09PQG160C feature comparison

XC3090-70PQ160C AMD Xilinx

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XC3190A-09PQG160C AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code QFP QFP
Package Description PLASTIC, QFP-160 QFP,
Pin Count 160 160
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA MAX USABLE 6000 LOGIC GATES
Clock Frequency-Max 70 MHz 370 MHz
Combinatorial Delay of a CLB-Max 9 ns 1.5 ns
JESD-30 Code S-PQFP-G160 S-PQFP-G160
JESD-609 Code e0 e3
Length 28 mm 28 mm
Moisture Sensitivity Level 3 3
Number of CLBs 320 320
Number of Equivalent Gates 5000 5000
Number of Inputs 138
Number of Logic Cells 320
Number of Outputs 138
Number of Terminals 160 160
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 320 CLBS, 5000 GATES 320 CLBS, 5000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Equivalence Code QFP160,1.2SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.92 mm 4.1 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 28 mm 28 mm
Base Number Matches 3 1

Compare XC3090-70PQ160C with alternatives

Compare XC3190A-09PQG160C with alternatives