XC3130-4PC84I vs XC2018-100PC84C feature comparison

XC3130-4PC84I AMD Xilinx

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XC2018-100PC84C AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code LCC LCC
Package Description QCCJ, LDCC84,1.2SQ PLASTIC, LCC-84
Pin Count 84 84
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX. 80 I/OS; 360 FLIP-FLOPS; TYP. GATES = 2000 - 2700 174 FLIP-FLOPS; TYP. GATES = 1000-1500
Clock Frequency-Max 230 MHz 100 MHz
Combinatorial Delay of a CLB-Max 3.3 ns 7.5 ns
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e0
Length 29.3116 mm 29.3116 mm
Moisture Sensitivity Level 3 3
Number of CLBs 100 100
Number of Equivalent Gates 2000 1000
Number of Inputs 74 74
Number of Logic Cells 100 100
Number of Outputs 74 74
Number of Terminals 84 84
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 100 CLBS, 2000 GATES 100 CLBS, 1000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.699 mm 5.08 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 29.3116 mm 29.3116 mm
Base Number Matches 1 1

Compare XC3130-4PC84I with alternatives

Compare XC2018-100PC84C with alternatives