XC3130-5PC84C vs AM2018-33JC084 feature comparison

XC3130-5PC84C AMD Xilinx

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AM2018-33JC084 AMD

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Part Package Code LCC LCC
Package Description PLASTIC, LCC-84 QCCJ, LDCC84,1.2SQ
Pin Count 84 84
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature MAX. 80 I/OS; 360 FLIP-FLOPS; TYP. GATES = 2000 - 2700
Clock Frequency-Max 190 MHz 33 MHz
Combinatorial Delay of a CLB-Max 4.1 ns 20 ns
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e0
Length 29.3116 mm 29.2862 mm
Moisture Sensitivity Level 3
Number of CLBs 100 100
Number of Equivalent Gates 2000 1800
Number of Inputs 74 74
Number of Logic Cells 100 100
Number of Outputs 74 74
Number of Terminals 84 84
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 100 CLBS, 2000 GATES 100 CLBS, 1800 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.699 mm 4.57 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 29.3116 mm 29.2862 mm
Base Number Matches 2 1

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Compare AM2018-33JC084 with alternatives