XC3S1000-4FT256C vs XC3S1000-4FT256I feature comparison

XC3S1000-4FT256C AMD Xilinx

Buy Now Datasheet

XC3S1000-4FT256I AMD Xilinx

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 17 X 17 MM, FTBGA-256 17 X 17 MM, FTBGA-256
Pin Count 256 256
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 630 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.61 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1920 1920
Number of Equivalent Gates 1000000 1000000
Number of Inputs 173 173
Number of Logic Cells 17280 17280
Number of Outputs 173 173
Number of Terminals 256 256
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1920 CLBS, 1000000 GATES 1920 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 1 1
Factory Lead Time 52 Weeks

Compare XC3S1000-4FT256C with alternatives

Compare XC3S1000-4FT256I with alternatives