XC3S1000-4FTG256I vs XC3S1000L-4FTG256C feature comparison

XC3S1000-4FTG256I AMD Xilinx

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XC3S1000L-4FTG256C AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 17 X 17 MM, LEAD FREE, FTBGA-256 LEAD FREE, FTBGA-256
Pin Count 256 256
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks
Clock Frequency-Max 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1920 1920
Number of Equivalent Gates 1000000 1000000
Number of Inputs 173 173
Number of Logic Cells 17280 17280
Number of Outputs 173 173
Number of Terminals 256 256
Organization 1920 CLBS, 1000000 GATES 1920 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 1 1
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

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Compare XC3S1000L-4FTG256C with alternatives