XC3S1000-4FTG256I vs XC3S700A-4FG400I feature comparison

XC3S1000-4FTG256I AMD Xilinx

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XC3S700A-4FG400I AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 17 X 17 MM, LEAD FREE, FTBGA-256 FBGA-400
Pin Count 256 400
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks 35 Weeks
Clock Frequency-Max 630 MHz 667 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.71 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B400
JESD-609 Code e1 e0
Length 17 mm 21 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1920 1472
Number of Equivalent Gates 1000000 700000
Number of Inputs 173 311
Number of Logic Cells 17280 13248
Number of Outputs 173 248
Number of Terminals 256 400
Organization 1920 CLBS, 1000000 GATES 1472 CLBS, 700000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA256,16X16,40 BGA400,20X20,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 2.43 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 21 mm
Base Number Matches 1 1
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Temperature Grade INDUSTRIAL

Compare XC3S1000-4FTG256I with alternatives

Compare XC3S700A-4FG400I with alternatives