XC3S100E-4CPG132C vs XC3S50-5CPG132C feature comparison

XC3S100E-4CPG132C AMD Xilinx

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XC3S50-5CPG132C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description CSP-132 8 X 8 MM, LEAD FREE, CSP-132
Pin Count 132 132
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks 4 Weeks
Clock Frequency-Max 572 MHz 725 MHz
Combinatorial Delay of a CLB-Max 0.76 ns 0.53 ns
JESD-30 Code S-PBGA-B132 S-PBGA-B132
JESD-609 Code e1 e1
Length 8 mm 8 mm
Moisture Sensitivity Level 3 3
Number of CLBs 240 192
Number of Equivalent Gates 100000 50000
Number of Inputs 83 89
Number of Logic Cells 2160 1728
Number of Outputs 72 89
Number of Terminals 132 132
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 240 CLBS, 100000 GATES 192 CLBS, 50000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA132,14X14,20 BGA132,14X14,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 8 mm 8 mm
Base Number Matches 2 1

Compare XC3S100E-4CPG132C with alternatives

Compare XC3S50-5CPG132C with alternatives