XC3S100E-5TQ144C
vs
XA3S100E-4TQG144I
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
End Of Life
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
TQFP-144
|
LEAD FREE, TQFP-144
|
| Reach Compliance Code |
compliant
|
compliant
|
| Clock Frequency-Max |
657 MHz
|
572 MHz
|
| Combinatorial Delay of a CLB-Max |
0.66 ns
|
4.88 ns
|
| JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
| JESD-609 Code |
e4
|
e3
|
| Length |
20 mm
|
20 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
240
|
240
|
| Number of Equivalent Gates |
100000
|
100000
|
| Number of Inputs |
108
|
108
|
| Number of Logic Cells |
2160
|
2160
|
| Number of Outputs |
80
|
80
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
240 CLBS, 100000 GATES
|
240 CLBS, 100000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP144,.87SQ,20
|
QFP144,.87SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
20 mm
|
20 mm
|
| Base Number Matches |
2
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
AEC-Q100
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|