XC3S1400A-5FG484C vs XC3S1400A-5FGG484C feature comparison

XC3S1400A-5FG484C AMD

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XC3S1400A-5FGG484C AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code End Of Life Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Package Description FBGA-484 FBGA-484
Reach Compliance Code not_compliant compliant
Clock Frequency-Max 770 MHz 770 MHz
Combinatorial Delay of a CLB-Max 0.62 ns 0.62 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2816 2816
Number of Equivalent Gates 1400000 1400000
Number of Inputs 375 375
Number of Logic Cells 25344 25344
Number of Outputs 288 288
Number of Terminals 484 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 2816 CLBS, 1400000 GATES 2816 CLBS, 1400000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Pin Count 484
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Factory Lead Time 12 Weeks

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