XC3S1400A-5FG676C vs XA3S1500-4FGG676I feature comparison

XC3S1400A-5FG676C AMD Xilinx

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XA3S1500-4FGG676I AMD

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description FBGA-676 LEAD FREE, FBGA-676
Pin Count 676
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Clock Frequency-Max 770 MHz 125 MHz
Combinatorial Delay of a CLB-Max 0.62 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e0 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2816 3328
Number of Equivalent Gates 1400000 1500000
Number of Inputs 502 487
Number of Logic Cells 25344 29952
Number of Outputs 408 487
Number of Terminals 676 676
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 2816 CLBS, 1400000 GATES 3328 CLBS, 1500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 2 2
Samacsys Manufacturer AMD
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Time@Peak Reflow Temperature-Max (s) 30

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