XC3S1500-4FG456I
vs
XC3S1400AN-4FG484I
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
23 X 23 MM, FBGA-456
|
FBGA-484
|
Pin Count |
456
|
484
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
52 Weeks
|
|
Clock Frequency-Max |
630 MHz
|
667 MHz
|
Combinatorial Delay of a CLB-Max |
0.61 ns
|
0.71 ns
|
JESD-30 Code |
S-PBGA-B456
|
S-PBGA-B484
|
JESD-609 Code |
e0
|
|
Length |
23 mm
|
23 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
3328
|
2816
|
Number of Equivalent Gates |
1500000
|
1400000
|
Number of Inputs |
333
|
375
|
Number of Logic Cells |
29952
|
25344
|
Number of Outputs |
333
|
288
|
Number of Terminals |
456
|
484
|
Organization |
3328 CLBS, 1500000 GATES
|
2816 CLBS, 1400000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA456,22X22,40
|
BGA484,22X22,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.6 mm
|
2.6 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
23 mm
|
23 mm
|
Base Number Matches |
1
|
1
|
Operating Temperature-Max |
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare XC3S1500-4FG456I with alternatives
Compare XC3S1400AN-4FG484I with alternatives