XC3S1500-4FG456I
vs
XC3S1400AN-5FG484C
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
XILINX INC
|
| Package Description |
23 X 23 MM, FBGA-456
|
FBGA-484
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| Samacsys Manufacturer |
AMD
|
|
| Clock Frequency-Max |
630 MHz
|
770 MHz
|
| Combinatorial Delay of a CLB-Max |
0.61 ns
|
0.62 ns
|
| JESD-30 Code |
S-PBGA-B456
|
S-PBGA-B484
|
| JESD-609 Code |
e0
|
|
| Length |
23 mm
|
23 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
3328
|
2816
|
| Number of Equivalent Gates |
1500000
|
1400000
|
| Number of Inputs |
333
|
375
|
| Number of Logic Cells |
29952
|
25344
|
| Number of Outputs |
333
|
288
|
| Number of Terminals |
456
|
484
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
3328 CLBS, 1500000 GATES
|
2816 CLBS, 1400000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA456,22X22,40
|
BGA484,22X22,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.6 mm
|
2.6 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
23 mm
|
23 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
484
|
| HTS Code |
|
8542.39.00.01
|
| Temperature Grade |
|
OTHER
|
|
|
|
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