XC3S200-4FTG256I vs XC3S200-4FT256I feature comparison

XC3S200-4FTG256I AMD Xilinx

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XC3S200-4FT256I AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 17 X 17 MM, LEAD FREE, FTBGA-256 17 X 17 MM, FTBGA-256
Pin Count 256 256
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 30 Weeks 30 Weeks
Clock Frequency-Max 630 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.61 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 480 480
Number of Equivalent Gates 200000 200000
Number of Inputs 173 173
Number of Logic Cells 4320 4320
Number of Outputs 173 173
Number of Terminals 256 256
Organization 480 CLBS, 200000 GATES 480 CLBS, 200000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 1 1

Compare XC3S200-4FTG256I with alternatives

Compare XC3S200-4FT256I with alternatives