XC3S2000-4FGG676I vs XC3S2000-4FGG676C feature comparison

XC3S2000-4FGG676I AMD

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XC3S2000-4FGG676C AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Package Description 27 X 27 MM, LEAD FREE, FBGA-676 27 X 27 MM, LEAD FREE, FBGA-676
Reach Compliance Code compliant compliant
Samacsys Manufacturer AMD
Clock Frequency-Max 630 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.61 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e1 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 5120 5120
Number of Equivalent Gates 2000000 2000000
Number of Inputs 489 489
Number of Logic Cells 46080 46080
Number of Outputs 489 489
Number of Terminals 676 676
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 5120 CLBS, 2000000 GATES 5120 CLBS, 2000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Pin Count 676
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Factory Lead Time 52 Weeks
Temperature Grade OTHER

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