XC3S2000-5FG456C vs XC3S2000-4FGG456I feature comparison

XC3S2000-5FG456C AMD Xilinx

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XC3S2000-4FGG456I AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 23 X 23 MM, FBGA-456 23 X 23 MM, LEAD FREE, FBGA-456
Pin Count 456 456
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 725 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.53 ns 0.61 ns
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e0 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 5120 5120
Number of Equivalent Gates 2000000 2000000
Number of Inputs 333 333
Number of Logic Cells 46080 46080
Number of Outputs 333 333
Number of Terminals 456 456
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 5120 CLBS, 2000000 GATES 5120 CLBS, 2000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,22X22,40 BGA456,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 2 2
Factory Lead Time 23 Weeks

Compare XC3S2000-5FG456C with alternatives

Compare XC3S2000-4FGG456I with alternatives