XC3S200AN-4FTG256I
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
|
Ihs Manufacturer |
XILINX INC
|
|
Part Package Code |
BGA
|
|
Package Description |
FTBGA-256
|
|
Pin Count |
256
|
|
Reach Compliance Code |
compliant
|
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Clock Frequency-Max |
667 MHz
|
|
Combinatorial Delay of a CLB-Max |
0.71 ns
|
|
JESD-30 Code |
S-PBGA-B256
|
|
JESD-609 Code |
e1
|
|
Length |
17 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
448
|
|
Number of Equivalent Gates |
200000
|
|
Number of Inputs |
195
|
|
Number of Logic Cells |
4032
|
|
Number of Outputs |
160
|
|
Number of Terminals |
256
|
|
Operating Temperature-Max |
100 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
448 CLBS, 200000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LBGA
|
|
Package Equivalence Code |
BGA256,16X16,40
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, LOW PROFILE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.55 mm
|
|
Supply Voltage-Max |
1.26 V
|
|
Supply Voltage-Min |
1.14 V
|
|
Supply Voltage-Nom |
1.2 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
17 mm
|
|
Base Number Matches |
1
|
|
|
|
|
Compare XC3S200AN-4FTG256I with alternatives