XC3S200AN-4FTG256I vs XC3S200A-5FTG256C feature comparison

XC3S200AN-4FTG256I AMD Xilinx

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XC3S200A-5FTG256C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FTBGA-256 FTBGA-256
Pin Count 256 256
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 667 MHz 770 MHz
Combinatorial Delay of a CLB-Max 0.71 ns 0.62 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 448 448
Number of Equivalent Gates 200000 200000
Number of Inputs 195 195
Number of Logic Cells 4032 4032
Number of Outputs 160 160
Number of Terminals 256 256
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 448 CLBS, 200000 GATES 448 CLBS, 200000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 1 1
Factory Lead Time 52 Weeks

Compare XC3S200AN-4FTG256I with alternatives

Compare XC3S200A-5FTG256C with alternatives