XC3S250E-4CP132C vs XA3S250E-4CPG132Q feature comparison

XC3S250E-4CP132C AMD Xilinx

Buy Now Datasheet

XA3S250E-4CPG132Q AMD Xilinx

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description CSP-132 LEAD FREE, CSP-132
Pin Count 132 132
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 572 MHz 572 MHz
Combinatorial Delay of a CLB-Max 0.76 ns 4.88 ns
JESD-30 Code S-PBGA-B132 S-PBGA-B132
JESD-609 Code e0 e1
Length 8 mm 8 mm
Moisture Sensitivity Level 3 3
Number of CLBs 612 612
Number of Equivalent Gates 250000 250000
Number of Inputs 92 92
Number of Logic Cells 5508 5508
Number of Outputs 85 85
Number of Terminals 132 132
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C
Organization 612 CLBS, 250000 GATES 612 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA132,14X14,20 BGA132,14X14,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER AUTOMOTIVE
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 8 mm 8 mm
Base Number Matches 2 1
Factory Lead Time 52 Weeks
Screening Level AEC-Q100

Compare XC3S250E-4CP132C with alternatives

Compare XA3S250E-4CPG132Q with alternatives