XC3S250E-4CPG132I vs XC3S250E-4CPG132C feature comparison

XC3S250E-4CPG132I AMD Xilinx

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XC3S250E-4CPG132C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description CSP-132 CSP-132
Pin Count 132 132
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks 52 Weeks
Clock Frequency-Max 572 MHz 572 MHz
Combinatorial Delay of a CLB-Max 0.76 ns 0.76 ns
JESD-30 Code S-PBGA-B132 S-PBGA-B132
JESD-609 Code e1 e1
Length 8 mm 8 mm
Moisture Sensitivity Level 3 3
Number of CLBs 612 612
Number of Equivalent Gates 250000 250000
Number of Inputs 92 92
Number of Logic Cells 5508 5508
Number of Outputs 85 85
Number of Terminals 132 132
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 612 CLBS, 250000 GATES 612 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA132,14X14,20 BGA132,14X14,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 8 mm 8 mm
Base Number Matches 2 2

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