XC3S400-4FG320C vs XC3S400-4FGG320C feature comparison

XC3S400-4FG320C AMD Xilinx

Buy Now Datasheet

XC3S400-4FGG320C AMD Xilinx

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 19 X 19 MM, FBGA-320 19 X 19 MM, LEAD FREE, FBGA-320
Pin Count 320 320
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 32 Weeks 32 Weeks
Clock Frequency-Max 630 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.61 ns
JESD-30 Code S-PBGA-B320 S-PBGA-B320
JESD-609 Code e0 e1
Length 19 mm 19 mm
Moisture Sensitivity Level 3 3
Number of CLBs 896 896
Number of Equivalent Gates 400000 400000
Number of Inputs 221 221
Number of Logic Cells 8064 8064
Number of Outputs 221 221
Number of Terminals 320 320
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 896 CLBS, 400000 GATES 896 CLBS, 400000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA320,18X18,40 BGA320,18X18,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 19 mm 19 mm
Base Number Matches 1 1

Compare XC3S400-4FG320C with alternatives

Compare XC3S400-4FGG320C with alternatives