XC3S4000-4FG676C vs XC3S2000-4FGG676I feature comparison

XC3S4000-4FG676C AMD Xilinx

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XC3S2000-4FGG676I AMD

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description 27 X 27 MM, FBGA-676 27 X 27 MM, LEAD FREE, FBGA-676
Pin Count 676
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Factory Lead Time 30 Weeks
Clock Frequency-Max 630 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.61 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e0 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6912 5120
Number of Equivalent Gates 4000000 2000000
Number of Inputs 489 489
Number of Logic Cells 62208 46080
Number of Outputs 489 489
Number of Terminals 676 676
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 6912 CLBS, 4000000 GATES 5120 CLBS, 2000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 2 2
Samacsys Manufacturer AMD
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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