XC3S4000-4FG676C
vs
XC3S4000-4FG676I
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
BGA
|
|
Package Description |
27 X 27 MM, FBGA-676
|
27 X 27 MM, FBGA-676
|
Pin Count |
676
|
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A991.D
|
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
30 Weeks
|
|
Clock Frequency-Max |
630 MHz
|
630 MHz
|
Combinatorial Delay of a CLB-Max |
0.61 ns
|
0.61 ns
|
JESD-30 Code |
S-PBGA-B676
|
S-PBGA-B676
|
JESD-609 Code |
e0
|
e0
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
6912
|
6912
|
Number of Equivalent Gates |
4000000
|
4000000
|
Number of Inputs |
489
|
489
|
Number of Logic Cells |
62208
|
62208
|
Number of Outputs |
489
|
489
|
Number of Terminals |
676
|
676
|
Operating Temperature-Max |
85 °C
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
6912 CLBS, 4000000 GATES
|
6912 CLBS, 4000000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA676,26X26,40
|
BGA676,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.6 mm
|
2.6 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
2
|
2
|
Samacsys Manufacturer |
|
AMD
|
|
|
|
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