XC3S4000-4FGG456I
vs
XC3S2000-5FG456C
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
End Of Life
|
| Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
BGA
|
|
| Package Description |
LEAD FREE, FBGA-456
|
23 X 23 MM, FBGA-456
|
| Pin Count |
456
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-PBGA-B456
|
S-PBGA-B456
|
| JESD-609 Code |
e1
|
e0
|
| Length |
23 mm
|
23 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
192
|
5120
|
| Number of Equivalent Gates |
50000
|
2000000
|
| Number of Terminals |
456
|
456
|
| Organization |
192 CLBS, 50000 GATES
|
5120 CLBS, 2000000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
250
|
225
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.6 mm
|
2.6 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
23 mm
|
23 mm
|
| Base Number Matches |
2
|
2
|
| Clock Frequency-Max |
|
725 MHz
|
| Combinatorial Delay of a CLB-Max |
|
0.53 ns
|
| Number of Inputs |
|
333
|
| Number of Logic Cells |
|
46080
|
| Number of Outputs |
|
333
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Equivalence Code |
|
BGA456,22X22,40
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
OTHER
|
|
|
|
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