XC3S5000-5FG456C vs XC3S4000-5FG456C feature comparison

XC3S5000-5FG456C AMD Xilinx

Buy Now Datasheet

XC3S4000-5FG456C AMD Xilinx

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-456 FBGA-456
Pin Count 456 456
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e0 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 192 192
Number of Equivalent Gates 50000 50000
Number of Terminals 456 456
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 192 CLBS, 50000 GATES 192 CLBS, 50000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 23 mm
Base Number Matches 1 1

Compare XC3S5000-5FG456C with alternatives

Compare XC3S4000-5FG456C with alternatives