XC3S5000-5FG456C
vs
XC3S4000-5FG456C
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
BGA
|
|
| Package Description |
FBGA-456
|
FBGA-456
|
| Pin Count |
456
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-PBGA-B456
|
S-PBGA-B456
|
| JESD-609 Code |
e0
|
e0
|
| Length |
23 mm
|
23 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
192
|
192
|
| Number of Equivalent Gates |
50000
|
50000
|
| Number of Terminals |
456
|
456
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
192 CLBS, 50000 GATES
|
192 CLBS, 50000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.6 mm
|
2.6 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
23 mm
|
23 mm
|
| Base Number Matches |
2
|
2
|
| Clock Frequency-Max |
|
725 MHz
|
| Combinatorial Delay of a CLB-Max |
|
0.53 ns
|
| Number of Inputs |
|
333
|
| Number of Outputs |
|
333
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare XC3S5000-5FG456C with alternatives