XC3S500E-4CPG132C
vs
XC3S500E-5CPG132C
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
CSP-132
|
8 X 8 MM, 1.10 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, CSP-132
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
AMD
|
AMD
|
| Clock Frequency-Max |
572 MHz
|
657 MHz
|
| Combinatorial Delay of a CLB-Max |
0.76 ns
|
0.66 ns
|
| JESD-30 Code |
S-PBGA-B132
|
S-PBGA-B132
|
| JESD-609 Code |
e1
|
e1
|
| Length |
8 mm
|
8 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
1164
|
1164
|
| Number of Equivalent Gates |
500000
|
500000
|
| Number of Inputs |
92
|
92
|
| Number of Logic Cells |
10476
|
10476
|
| Number of Outputs |
85
|
85
|
| Number of Terminals |
132
|
132
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1164 CLBS, 500000 GATES
|
1164 CLBS, 500000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Equivalence Code |
BGA132,14X14,20
|
BGA132,14X14,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
2
|
2
|
|
|
|