XC3S500E-4CPG132CS1 vs XC3S500E-5CP132C feature comparison

XC3S500E-4CPG132CS1 AMD Xilinx

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XC3S500E-5CP132C AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description TFBGA, BGA132,14X14,20 8 X 8 MM, 1.10 MM HEIGHT, 0.50 MM PITCH, CSP-132
Pin Count 132 132
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 572 MHz 657 MHz
Combinatorial Delay of a CLB-Max 0.76 ns 0.66 ns
JESD-30 Code S-PBGA-B132 S-PBGA-B132
JESD-609 Code e1 e0
Length 8 mm 8 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1164 1164
Number of Equivalent Gates 500000 500000
Number of Inputs 92 92
Number of Logic Cells 10476 10476
Number of Outputs 85 85
Number of Terminals 132 132
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1164 CLBS, 500000 GATES 1164 CLBS, 500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA132,14X14,20 BGA132,14X14,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 8 mm 8 mm
Base Number Matches 1 2
Pbfree Code No
ECCN Code EAR99

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