XC3S700A-4FGG400C vs XC3S700A-4FG400C feature comparison

XC3S700A-4FGG400C AMD Xilinx

Buy Now Datasheet

XC3S700A-4FG400C AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-400 FBGA-400
Pin Count 400 400
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 35 Weeks 35 Weeks
Clock Frequency-Max 667 MHz 667 MHz
Combinatorial Delay of a CLB-Max 0.71 ns 0.71 ns
JESD-30 Code S-PBGA-B400 S-PBGA-B400
JESD-609 Code e1 e0
Length 21 mm 21 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1472 1472
Number of Equivalent Gates 700000 700000
Number of Inputs 311 311
Number of Logic Cells 13248 13248
Number of Outputs 248 248
Number of Terminals 400 400
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1472 CLBS, 700000 GATES 1472 CLBS, 700000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA400,20X20,40 BGA400,20X20,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.43 mm 2.43 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 21 mm 21 mm
Base Number Matches 1 1

Compare XC3S700A-4FGG400C with alternatives

Compare XC3S700A-4FG400C with alternatives