XC3SD1800A-4CS484I vs XC3SD1800A-4CSG484C feature comparison

XC3SD1800A-4CS484I AMD Xilinx

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XC3SD1800A-4CSG484C AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description CSBGA-484 LEAD FREE, CSBGA-484
Pin Count 484 484
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks 52 Weeks
Clock Frequency-Max 250 MHz 250 MHz
Combinatorial Delay of a CLB-Max 0.71 ns 0.71 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 19 mm 19 mm
Moisture Sensitivity Level 3 3
Number of CLBs 4160 4160
Number of Equivalent Gates 1800000 1800000
Number of Inputs 309 309
Number of Logic Cells 37440 37440
Number of Outputs 249 249
Number of Terminals 484 484
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4160 CLBS, 1800000 GATES 4160 CLBS, 1800000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,32 BGA484,22X22,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 19 mm 19 mm
Base Number Matches 1 1
Temperature Grade COMMERCIAL EXTENDED

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Compare XC3SD1800A-4CSG484C with alternatives