XC3SD3400A-4CSG484C vs XC3SD3400A-4CS484LI feature comparison

XC3SD3400A-4CSG484C AMD Xilinx

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XC3SD3400A-4CS484LI AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LEAD FREE, CSBGA-484 CSBGA-484
Pin Count 484 484
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks 52 Weeks
Clock Frequency-Max 250 MHz 250 MHz
Combinatorial Delay of a CLB-Max 0.71 ns 0.71 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e0
Length 19 mm 19 mm
Moisture Sensitivity Level 3 3
Number of CLBs 5968 5968
Number of Equivalent Gates 3400000 3400000
Number of Inputs 309 309
Number of Logic Cells 53712 53712
Number of Outputs 249 249
Number of Terminals 484 484
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 5968 CLBS, 3400000 GATES 5968 CLBS, 3400000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,32 BGA484,22X22,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 19 mm 19 mm
Base Number Matches 1 1

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