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XC4028XL-1BG256C vs XC4028XL-1BG256I feature comparison

XC4028XL-1BG256C AMD Xilinx

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XC4028XL-1BG256I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-256 PLASTIC, BGA-256
Pin Count 256 256
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 28000 LOGIC GATES MAX USABLE 28000 LOGIC GATES
Clock Frequency-Max 200 MHz 200 MHz
Combinatorial Delay of a CLB-Max 1.3 ns 1.3 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1024 1024
Number of Equivalent Gates 18000 18000
Number of Inputs 256 256
Number of Logic Cells 1024 1024
Number of Outputs 256 256
Number of Terminals 256 256
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1024 CLBS, 18000 GATES 1024 CLBS, 18000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,20X20,50 BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 1 1
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

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