XC4036XL-3BGG352I vs XC4044XL-09CBG352C feature comparison

XC4036XL-3BGG352I AMD Xilinx

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XC4044XL-09CBG352C AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, LBGA, BGA352,26X26,50
Pin Count 352 352
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 36000 LOGIC GATES MAX USABLE 44000 LOGIC GATES
Clock Frequency-Max 166 MHz 217 MHz
Combinatorial Delay of a CLB-Max 1.6 ns 1.2 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e1 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1296 1600
Number of Equivalent Gates 22000 27000
Number of Inputs 288 289
Number of Outputs 288 289
Number of Terminals 352 352
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1296 CLBS, 22000 GATES 1600 CLBS, 27000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1
Number of Logic Cells 3800
Temperature Grade OTHER

Compare XC4036XL-3BGG352I with alternatives

Compare XC4044XL-09CBG352C with alternatives