XC4052XLA-8BGG352C vs XC4044XL-3BG352I feature comparison

XC4052XLA-8BGG352C AMD Xilinx

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XC4044XL-3BG352I AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, PLASTIC, BGA-352
Pin Count 352 352
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 263 MHz 166 MHz
Combinatorial Delay of a CLB-Max 1 ns 1.6 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e1 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1936 1600
Number of Equivalent Gates 33000 27000
Number of Terminals 352 352
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1936 CLBS, 33000 GATES 1600 CLBS, 27000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 1 1
Additional Feature MAX USABLE 44000 LOGIC GATES
Number of Inputs 320
Number of Logic Cells 1600
Number of Outputs 320
Package Equivalence Code BGA352,26X26,50
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

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Compare XC4044XL-3BG352I with alternatives