XC4085XLA-07BG560C vs XC4062XL-08BG560C feature comparison

XC4085XLA-07BG560C AMD Xilinx

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XC4062XL-08BG560C AMD Xilinx

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-560
Pin Count 560
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 180000 GATES TYPICAL GATES = 40000-130000
Clock Frequency-Max 294 MHz 238 MHz
Combinatorial Delay of a CLB-Max 0.9 ns 1.1 ns
JESD-30 Code S-PBGA-B560 R-PBGA-B560
JESD-609 Code e0 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3136 2304
Number of Equivalent Gates 55000 40000
Number of Inputs 448 384
Number of Logic Cells 3136 2304
Number of Outputs 448 384
Number of Terminals 560 560
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 3136 CLBS, 55000 GATES 2304 CLBS, 40000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50 BGA560,33X33,50
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead (Sn63Pb37) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1

Compare XC4085XLA-07BG560C with alternatives

Compare XC4062XL-08BG560C with alternatives