XC4VFX60-11FFG1152C vs XC4VFX60-11FF1152I feature comparison

XC4VFX60-11FFG1152C AMD Xilinx

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XC4VFX60-11FF1152I AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LEAD FREE, FBGA-1152 FBGA-1152
Pin Count 1152 1152
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks
Clock Frequency-Max 1181 MHz 1181 MHz
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e1 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 6320 6320
Number of Inputs 576 576
Number of Logic Cells 56880 56880
Number of Outputs 576 576
Number of Terminals 1152 1152
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 6320 CLBS 6320 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 2 2

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