XC4VLX15-11FF668C vs XC4VLX15-11FFG676IS2 feature comparison

XC4VLX15-11FF668C AMD Xilinx

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XC4VLX15-11FFG676IS2 AMD Xilinx

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description FBGA-668
Pin Count 668
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 37 Weeks
Clock Frequency-Max 1205 MHz
JESD-30 Code S-PBGA-B668
JESD-609 Code e0
Length 27 mm
Moisture Sensitivity Level 4 4
Number of CLBs 1536
Number of Inputs 320
Number of Logic Cells 13824
Number of Outputs 320
Number of Terminals 668
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1536 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA668,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.85 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm
Base Number Matches 2 1

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