XC4VLX15-11FF668IS2
vs
XC4VLX15-11SFG363IS2
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
1205 MHz
|
1205 MHz
|
| JESD-30 Code |
S-PBGA-B668
|
S-PBGA-B363
|
| JESD-609 Code |
e0
|
e1
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of Inputs |
320
|
240
|
| Number of Logic Cells |
13824
|
13824
|
| Number of Outputs |
320
|
240
|
| Number of Terminals |
668
|
363
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
FBGA
|
| Package Equivalence Code |
BGA668,26X26,40
|
BGA363,20X20,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
225
|
260
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
FBGA, BGA363,20X20,32
|
|
|
|
Compare XC4VLX15-11FF668IS2 with alternatives
Compare XC4VLX15-11SFG363IS2 with alternatives