XC4VLX15-11FFG668C vs XC4VLX15-11FF676IS2 feature comparison

XC4VLX15-11FFG668C AMD

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XC4VLX15-11FF676IS2 AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Package Description LEAD FREE, FBGA-668
Reach Compliance Code not_compliant not_compliant
Factory Lead Time 12 Weeks
Clock Frequency-Max 1205 MHz
Combinatorial Delay of a CLB-Max 0.17 ns
JESD-30 Code S-PBGA-B668
JESD-609 Code e1
Length 27 mm
Moisture Sensitivity Level 4
Number of CLBs 1536
Number of Inputs 320
Number of Logic Cells 13824
Number of Outputs 320
Number of Terminals 668
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1536 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA668,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.85 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm
Base Number Matches 2 1
HTS Code 8542.39.00.01

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